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Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc

Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc

Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc

Szczegóły Produktu:

Place of Origin: China
Nazwa handlowa: Civen
Orzecznictwo: ISO 9001 CERTIFICATE
Model Number: MGP-TRA021022


Minimum Order Quantity: 1000 KG ( 2205 LB )
Cena: Negotiate
Packaging Details: Strengthen Cardboard Inner Core And Exporting Wooden Case
Delivery Time: 10-15DAYS
Payment Terms: T/T
Supply Ability: 550 MT Per Month
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Szczegółowy opis produktu
Materiał: Czerwona miedź Zwykła grubość: 12 um / 18 um / 35 um / 70um
Zwykła szerokość: Do 600 mm (23,6 cala) Matowa strona: szary kolor
Rodzaj: ROLKA Pakiet: Drewniany pakiet do fumigacji

Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc


CIVEN delivers a wide range of copper and its alloy products to demanding customers in the electrotechnical industry. In the last ten years we have developed into one of the leading Chinesesuppliers of copper material. During this period we were able to make use of decades of experience from contacts with our customers, responding specifically to individual wishes and guaranteeing top-quality products.



Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film.



High flexibility and extensibility

Even and smooth surface

Good fatigue resistance

Strong antioxidant properties

Good mechanical properties



The material has higher extensibility, and has a high bending resistance and no crack.


Table 1:FPC T2 high flex rolled copper foil properties (IPC-6542)

Item Unit Parameters
12μm 18μm 25μm 35μm 70μm
Mass per unit(±5%) g/m² 105 160 300 400 445
Cu+Ag % ≥99.99
Temper   H O,H O,H O,H O,H
Surface roughness Ra μm 0.13 0.12 0.1 0.08 0.08
Rz μm 1.3 1.0 0.8 0.74 0.76
Tensile strength Normal Temp /23℃ N/mm² ≥430 ≥450 ≥450 ≥450 ≥450
High Temp /220℃ N/mm² ≥140 ≥150 ≥170 ≥210 ≥220
Elongation Normal Temp /23℃ % ≥1.5 ≥3.0 ≥4.0 ≥4.2 ≥4.5
High Temp /220℃ % ≥8 ≥10 ≥18 ≥28 ≥30
Fatigue Resistance (annealed) % 65 65 65 65 65
Maximum resistivity Ωmm2/m 0.0181
Electrical conductivity % ≥98.3%
Film and adhesive layers Instant Temp. 300℃/10s Film and adhesive paste after transient temperature without blistering delamination.
Anti oxidation H.T.(200℃) Minute Won’t Change the Color within 60 minutes
Pinhole test results piece/ m² Pinhole area more than 0.5 mm²,0.005 piece/ m²

Note: 1. Above figures based on the material with 0.05mm in thickness and 600mm in width.

2. Normally, Copper, cobalt and nickel is coated on the rough surface.

3. Testing method follows our company standard.


Szczegóły kontaktu
Civen Metal Material(Shanghai) Co.,Ltd

Osoba kontaktowa: Mr. Duearwin Moon

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